| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of delivering a semiconductor manufacturing composite solution, a manufacturing method, a pipe line and a manufacturing apparatus, thoroughly restraining the mixing-in of a foreign matter that can cause a defect in a manufacturing process, and remarkably reducing a content of the foreign matter. SOLUTION: The solution is delivered using the pipe line the inner surface of which satisfies the following relational expression: Ra<X between the value (Ra:μm) of arithmetic mean roughness showing the surface smoothness and the size (X:μm) of the foreign matter in the delivered semiconductor manufacturing composite solution. Alternatively, the solution is delivered using the pipe line the inner surface of which satisfies the following relational expression: Rz<3X between the value (Rz:μm) of a ten-point height of irregularities showing the surface smoothness and the size (X:μm) of the foreign matter in the semiconductor manufacturing composite solution. COPYRIGHT: (C)2010,JPO&INPIT |
