COPPER FILM FORMING COMPOSITION AND METHOD FOR MANUFACTURING COPPER FILM

摘要

PROBLEM TO BE SOLVED: To provide a copper film forming composition converted into a copper film excellent in storage stability and application performance and excellent in conductivity at low temperature.SOLUTION: The copper film forming composition comprises (A) a copper formate or a hydrate thereof and (B) a monoamine compound having a boiling point in a range of 100-250°C. The component B includes 0.25 pts.mol or more of at least one kind selected from a group consisting of 2-ethylhexyl amine and 2-amino heptane to 1 pts.mol of the monoamine compound of the component B and is included in the range of 2-6 pts.mol to 1 pts.mol of the anhydride of the component A. An organic solvent having a boiling point in the range of 80°C or more and 250°C or less can be included as a component C.SELECTED DRAWING: None