METHOD OF PRODUCING LIGHT-EMITTING DIODES, CUTTING METHOD, AND LIGHT-EMITTING DIODE

摘要

Disclosed are a method for producing light-emitting diodes and a cutting method with which defects such as dicing line misalignments caused by heat generated during laser cutting of a metal substrate can be prevented, and with which adverse effects due to debris produced during cutting can be reduced. Also disclosed is a light-emitting diode. The method for producing light-emitting diodes comprises: a step for manufacturing a wafer provided with a metal substrate comprising a plurality of metal layers, and a compound semiconductor layer containing a light-emitting layer formed on said metal substrate; a step for removing part of the compound semiconductor layer on the intended cutting line by etching; a step for removing part of at least one of the plurality of metal layers on the opposite side to the laser irradiation surface on the intended cutting line by etching; and a step for cutting the metal substrate by irradiating a laser along the part removed from the metal layer in a plan view.