发明名称 BACK-FACE ELECTRON IMPACT HEATING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To heat the entire surface of a heating object 7 uniformly when the object is heated by electron impact by eliminating temperature gradient of a heating plate 2 so that a uniform temperature distribution is formed. <P>SOLUTION: The back-face electron impact heating device comprises a filament 9 provided on the back of a heating plate 2, a heating power supply 12 which heats the filament 9, an acceleration power supply 11 which applies an acceleration voltage to the filament 9, and a reflector 3 which reflects electrons which are emitted from the filament 9 and accelerated by the acceleration voltage applied from the acceleration power supply 11 toward the heating plate 2. Reflection surface of the reflector 3 has a gradient so that its part facing the center part of the heating plate 2 becomes closer to the heating plate 2 than its part facing the peripheral part of the heating plate 2. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012003839(A) 申请公布日期 2012.01.05
申请号 JP20100134638 申请日期 2010.06.14
申请人 SUKEGAWA ELECTRIC CO LTD 发明人 HAGA SHIGETAKA;MIURA KUNIAKI
分类号 H05B7/00;C23C14/24 主分类号 H05B7/00
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