发明名称 |
Interposer-on-Glass Package Structures |
摘要 |
A device includes an interposer including a substrate, and a first through-substrate via (TSV) penetrating through the substrate. A glass substrate is bonded to the interposer through a fusion bonding. The glass substrate includes a second TSV therein and electrically coupled to the first TSV.
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申请公布号 |
US2011304999(A1) |
申请公布日期 |
2011.12.15 |
申请号 |
US20100834943 |
申请日期 |
2010.07.13 |
申请人 |
YU CHEN-HUA;LIN JING-CHENG;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
YU CHEN-HUA;LIN JING-CHENG |
分类号 |
H05K1/18;H05K1/11;H05K3/00 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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