发明名称 ELECTRONIC DEVICE MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To solve the problem with a conventional process that while no cracks and transcription and physical defects were observed, there were electrical malfunctions which resulted in a low yield, the conventional process being used for transcribing active elements formed on a glass substrate onto a film and then removing the glass substrate to leave the active elements on the film to form a thin-film, lightweight active element substrate. <P>SOLUTION: A manufacturing process has added thereto a step for heat-treating a plastic film 102 in an atmosphere where it contains exposed moisture vapor. Heat treatment in moisture vapor permits moisture contents to penetrate into the plastic film 102. This moisture vapor heat treatment results in a threshold voltage value of a transistor being brought back to a normal value near 0 V and further the current consumption of a semiconductor circuit and its standard deviation being reduced. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011249440(A) 申请公布日期 2011.12.08
申请号 JP20100119043 申请日期 2010.05.25
申请人 SEIKO EPSON CORP 发明人 MIYASAKA MITSUTOSHI;KIMURA NAOMI;KAWASE TAKEO
分类号 H01L29/786;H01L21/02;H01L21/324;H01L21/336;H01L27/12 主分类号 H01L29/786
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