| 摘要 |
PURPOSE: A method for manufacturing an LED package is provided to reduce manufacturing costs by forming a dome with a desirable height through one silicon filling process. CONSTITUTION: A substrate(11) with a cavity(13) is prepared. An LED chip(21) is mounted on the bottom of the cavity. The surface of the substrate is processed with plasma. Interfacial separation solutions(27) are coated on the surface of the substrate except the cavity. Light transmitting resin(31) is filled in the cavity to cover the LED chip.
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