发明名称 |
Lead frame with solder flow control |
摘要 |
A lead frame has multiple regions having different wetting characteristics on its surface. For example, one region is formed to handle silver plating while another has less wetting ability. A boundary between the regions causes a wetting force difference that inhibits molten solder flow between regions during solder die bonding. |
申请公布号 |
US8050048(B2) |
申请公布日期 |
2011.11.01 |
申请号 |
US20080053622 |
申请日期 |
2008.03.24 |
申请人 |
FREESCALE SEMICONDUCTOR, INC. |
发明人 |
XU XUESONG;SONG MEIJIANG;YAO JINZHONG |
分类号 |
H02B1/56;H01L23/48;H01L23/52;H01R43/00;H05K5/02 |
主分类号 |
H02B1/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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