发明名称 |
STRIPPING DEVICE AND STRIPPING METHOD |
摘要 |
A stripping method for stripping a support plate from a laminate including a substrate and the support plate adhered to the wafer via an adhesive layer, in which the adhesive layer is formed from an adhesive compound soluble in a non-polar solvent or a highly polar solvent; and the stripping method includes the step of supplying the non-polar solvent or the highly polar solvent, so that the non-polar solvent or the highly polar solvent is retained at least on an edge portion of that surface of the laminate which faces the support plate, and on a lateral surface of the laminate.
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申请公布号 |
US2011259527(A1) |
申请公布日期 |
2011.10.27 |
申请号 |
US201113093412 |
申请日期 |
2011.04.25 |
申请人 |
TOKYO OHKA KOGYO CO., LTD. |
发明人 |
NAKADA KIMIHIRO;IWATA YASUMASA;NAKAMURA AKIHIKO;INAO YOSHIHIRO;KOBARI SATOSHI |
分类号 |
B32B38/10 |
主分类号 |
B32B38/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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