发明名称 Carrier module for use in a handler and handler for handling packaged chips for a test using the carrier modules
摘要 Provided is a carrier module for use in a handler for handling a packaged chip for a test, the carrier module including a body provided, a base plate where the packaged chips are placed, provided to the body, and at least one latch which holds the packaged chips in position in the base plate.
申请公布号 US8026516(B2) 申请公布日期 2011.09.27
申请号 US20070987186 申请日期 2007.11.28
申请人 MIRAE CORPORATION 发明人 AN JUNG UG;BEOM HEE RAK;YUN DAE GON
分类号 H05K7/02 主分类号 H05K7/02
代理机构 代理人
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