| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermosetting thermally conductive composition which has excellent heat resistance and durability and in which the contact fault by a cyclic siloxane or the like, that is considered as a problem in a conventional technique, is remedied and which cures when it is heated, and to provide a thermally conductive material obtained by curing the composition. <P>SOLUTION: The thermally conductive material having a thickness of <0.5 mm is obtained by applying the thermally curable composition to between a heating element and a heat dissipation body and curing the applied composition between the heating element and the heat dissipation body, wherein the thermally curable composition is composed of a vinyl polymer (I) having on average at least one crosslinkable (meth)acryloyl group and a thermally conductive filler (II), and has viscosity of ≤6,000 Pa s before being cured and flowability at room temperature. <P>COPYRIGHT: (C)2011,JPO&INPIT |
