| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method and an apparatus for releasing a protection tape, capable of easily releasing the protection tape from a wafer even when the tape is not adhered to the wafer along the outer periphery of the wafer. <P>SOLUTION: The method includes the steps of: mounting a wafer on a stage, on which a protection tape is adhered so as to be superposed on only a portion of a notch; adhering a releasing adhesive tape to the protection tape; lifting up the protection tape of the notch with the top surface of a lift pin by protruding the lift pin from the stage; and releasing the protection tape from the wafer by pulling the releasing adhesive tape while lifting up the protection tape with the lift pin. The top surface of the lift pin is shaped so that the top surface of the lift pin may lift up the protection tape of the notch. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
