| 摘要 |
<p>PURPOSE: A multilayer adhesive film for a reinforcement plate attachment process of a flexible printed circuit board is provided to ensure excellent workability and cushion property and to prevent the damage of a reinforcement plate and a flexible printed circuit board since a batch process from a blanking process to an attachment process. CONSTITUTION: A heat resistant adhesive film has a trilayered structure of a polyolefin-based base film, thermal resistant adhesive, and release paper or a pentalayered structure formed by laminating the trilayered structure and an adhesive film coating adhesives on a polyester film. The polyolefin-based base film is the soft film such as polyvinylchloride, polypropylene, and polyethylene. The thickness of the polyolefin-based base film is 50~200 micron.</p> |
