| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a flexible printed circuit board with a reinforcing layer, capable of reliably reducing the occurrence of a gap of a second adhesive layer disposed on an edge of a first reinforcing layer to make a highly reliable flexible printed circuit board with a reinforcing layer. SOLUTION: The first reinforcing layer 4 is adhered via a first adhesive layer 3 under the flexible printed circuit board 2 so that a rear edge 8 of the first reinforcing layer 4 is included in the flexible printed circuit board 2 when projected in a thickness direction. A filling adhesive layer 7 is stacked under a flexible printed circuit board 1 exposed from the first reinforcing layer 4 to be adjacent to a rear edge 25 of the first adhesive layer 3 with a thickness t3 smaller than a total thickness T of the first adhesive layer 3 and the first reinforcing layer 4. A second reinforcing layer 6 is adhered via the filling adhesive layer 7 and a second adhesive layer 5 under the first reinforcing layer 4 and the flexible printed circuit board 2 exposed from the first reinforcing layer 4. COPYRIGHT: (C)2011,JPO&INPIT |
