| 发明名称 |
RULE-BASED SEMICONDUCTOR DIE STACKING AND BONDING WITHIN A MULTI-DIE PACKAGE |
| 摘要 |
A rule-based method of optimizing wire bonding jumps is disclosed which minimizes the amount of wire used for wire bonds and/or minimizes a number of power and ground pads on a substrate to support all wired connections. |
| 申请公布号 |
WO2011097559(A1) |
申请公布日期 |
2011.08.11 |
| 申请号 |
WO2011US23884 |
申请日期 |
2011.02.07 |
| 申请人 |
SANDISK CORPORATION;WU, CHARLES, HUNG-HSIANG |
发明人 |
WU, CHARLES, HUNG-HSIANG |
| 分类号 |
G11C5/06;H01L25/065 |
主分类号 |
G11C5/06 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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