| 摘要 |
The present invention provides a process for producing printed board having cable portion, including the following steps: (1) For the copper foil of a one side copper clad laminate which is laminatedon an inner layer core substrate, a flexible cable portion circuit pattern is formed and a connection pad portion is formed at the distal end on the component mounting portion side of the flexible cable portion circuit pattern; (2) A surface protection insulating film is formed excepting a part of the front end of the components setting parts of the connection pad portion formed in the flexible cable portion circuit pattern and a connection pad portion; (3) On at least one side of the inner layer core substrate, a laminate is formed by laminating the one side copper clad laminate formed in theneeded said components setting parts such that the copper foil is directed toward the outer surface; (4) An outer layer circuit pattern is formed by etching on the copper foil of the one side copperclad laminate formed in the flexible cable portion circuit pattern and a connection pad portion; (5) A surface protection insulating film having an opening at a required position is formed on the outer layer circuit pattern including the connection pad portion. |
