PACKAGE STRUCTURE OF COMPOUND SEMICONDUCTOR AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A package for storage of a compound semiconductor device is provided to improve that reflective efficiency downs by a metal reflective layer being faded and to prevent a short circuit between a glass reflecting layer and an electrode. CONSTITUTION: A substrate(506) comprises a first surface and a second surface facing each other. A plurality of metal posts passes through the substrate. A metal layer is formed in the first surface of the substrate. A frame body(524) forms a function region by being surrounded on the metal layer and a main part is formed in a central part. A glass reflecting layer is coated on the function region and the inner circumferential side of the frame body and exposes a first electrode area(516) and a second electrode area(518) electrically connected in the metal post. One and more compound semiconductor devices are attached and fixed on the glass reflecting layer of the function region and are electrically connected to the first electrode area and the second electrode area. Transparent resin(538) seals the compound semiconductor device. The diameter of a hole of the glass reflection layer surface is small than the diameter of a hole of the substrate surface and the frame body surface.