发明名称 |
LEITERPLATTE MIT INTEGRIERTEN ELEKTRONISCHEN KOMPONENTEN UND HERSTELLUNGSVERFAHREN DAFÜR |
摘要 |
A method of manufacturing an electronic component-embedded board is provided which is capable of suppressing warpage without requiring complicated processes at low cost and which offers high productivity and economic efficiency. A worksheet 100 includes insulating layers 21 and 31 on one surface of an approximately rectangular substrate 11, and electronic components 41 and chip-like dummy parts 51 primarily made from the same material as the primary material of the electronic component 41 are embedded into the insulating layer 21. Chip-like dummy parts 51 are disposed in an unmounted portion of the electronic components 41 in, for example, a frame-like arrangement so as to surround the plurality of electronic components (groups) 41. |
申请公布号 |
AT516694(T) |
申请公布日期 |
2011.07.15 |
申请号 |
AT20080013360T |
申请日期 |
2008.07.24 |
申请人 |
TDK CORPORATION |
发明人 |
KANEMARU, YOSHIKAZU;OHKAWA, HIROSHIGE;KAWABATA, KENICHI |
分类号 |
H05K3/28 |
主分类号 |
H05K3/28 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|