WAFER LEVEL STACK DIE PACKAGE

摘要

PURPOSE: A wafer level stack die package is provided to use a plurality of bond pads for mounting an IC package in an interconnection substrate on the active side of a semiconductor. CONSTITUTION: In a wafer level stack die package, a first individual component part is manufactured for a semiconductor substrate. A second individual component part is manufactured in the semiconductor substrate and is adjacent to the first component. An IC die(114) is mounted in the semiconductor substrate and connects the first component to the second component.