| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor contact sheet, and a method for manufacturing the same, capable of obtaining accurate dimensions, and preventing semiconductor inspection errors caused by a contact failure with a bump of a semiconductor circuit surface or a connection failure in bump connection, in an effective manner. SOLUTION: The semiconductor contact sheet 1 has a constitution, including a plate glass 2 whose thickness t is 5-50μm; a glass projection 3 projected from one surface of the plate glass 2; a hard metal coating 4 for coating the surface of the projection 3; a signal wire 5, formed on one surface of the plate glass 2 which is electrically continuous with the hard metal coating 4; and a support film 6 bonded to the other surface of the plate glass 2. COPYRIGHT: (C)2011,JPO&INPIT
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