| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device for preventing separation or the like in an interface by efficiently reinforcing the interface between an end face of a semiconductor chip and a fillet against thermal stress generated by the warpage at low and high temperatures. <P>SOLUTION: In the semiconductor device for sealing an area between the semiconductor chip 2 and an interposer 7 by using an underfill 9, a plurality of linear irregular sections 5 along a horizontal direction having widths W<SB>1</SB>of 30-50μm in depth directions are provided at least at one portion of an end face 3 of the semiconductor chip 2. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
