发明名称 MOLDING MATERIAL, MOLDING, AND METHOD FOR PRODUCING THE SAME, AND HOUSING FOR ELECTRIC AND ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide a molding material and a molding having characteristics such as high stiffness (flexural modulus), good flexural strength, high heat distortion temperature, and excellent molding processability, and further good impact resistance (Charpy impact strength), biodegradability, and burning characteristics. SOLUTION: The molding material includes a cellulose derivative which contains at least one group wherein a hydrogen atom of a hydroxy group contained in the cellulose is substituted with the following (A), and at least one group wherein a hydrogen atom of a hydroxy group contained in the cellulose is substituted with the following (B); and wood flour: (A) a hydrocarbon group: -R<SB>A</SB>, (B) an acyl group: -CO-R<SB>B</SB>(in which R<SB>B</SB>represents a hydrocarbon group). COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011132451(A) 申请公布日期 2011.07.07
申请号 JP20090295084 申请日期 2009.12.25
申请人 FUJIFILM CORP 发明人 NAGAI TAKAYASU;SAWAI DAISUKE;YOSHITANI SHUNEI;KAMIHIRA SHIGEO
分类号 C08L1/10;C08B13/00;C08K9/04;C08L97/02 主分类号 C08L1/10
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