LED PACKAGE AND METHOD OF WAFER-LEVEL MOLDING FOR THEREOF

摘要

PURPOSE: An LED package and a method of wafer-level molding for thereof are provided to simplify a molding process by processing molding in a wafer state by using a light-emitting diode package. CONSTITUTION: A light-emitting diode package comprises an LED(520) formed on an epitaxial wafer(Epi wafer). An n-type semiconductor layer, an active layer, and a p-type semiconductor layer are successively formed on a transparent layer to form a light emitting structure. The light emitting structure is exposed to have a certain width on the n-type semiconductor layer by etching the active layer and the p-type semiconductor layer. An n type electrode is formed on the exposed n-type semiconductor layer. A reflective electrode is formed on the p-type semiconductor layer and reflect light. The p-type electrode is formed on the reflective electrode.