| 摘要 |
PROBLEM TO BE SOLVED: To provide a solid-state imaging element and imaging device, which apply a uniform voltage to a photoelectric conversion film provided on a substrate. SOLUTION: The solid-state imaging element 30 includes a wiring part 24 supplying a voltage for producing an electric field between an upper electrode 16 and a lower electrode 14 to the upper electrode 16. When a region provided with a photoelectric conversion element P including the lower electrode 14, photoelectric conversion film 15 and upper electrode 16 is a sensor region S, a plurality of connections 22 connecting the wiring part 24 and the upper electrode 16 are provided in a peripheral region other than the sensor region S, wherein the connections 22 are symmetrical to each other with respect to the sensor region S, and the sensor region S is positioned in the center of the photoelectric conversion film 15. COPYRIGHT: (C)2011,JPO&INPIT
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