| 摘要 |
PURPOSE: A stack package is provided to prevent a short circuit between bonding wires by arranging adjacent staked semiconductor chips to be crossed with each other to reduce the angle of the bonding wire. CONSTITUTION: In a stack package, a plurality of connection pads(111) are formed in the top side of a substrate(110). The substrate comprises a top side, a bottom side, and a side. A connection pad and the ball land are electrically connected to a conductive via which is formed inside a substrate. A first bonding pad(121) and a second bonding pad(131) are formed on the top side of semiconductor chips(120,130). A bonding wire(140) electrically interlinks connection pads of the substrate with bonding pads of the semiconductor chips. |
