| 摘要 |
A thin plate container includes: a tray stack for holding and housing semiconductor wafers in spaces between a plurality of stacked, removable loading trays; and an external container for housing the tray stack. At opposite ends of each of the loading trays, a pair of grips for engagement by a processing arm of an external apparatus is provided. The external container includes: a container body; a lid; a sealing material provided between the lid and the container body to seal the inside; a pair of tray stack supporters for supporting the tray stack; and tray stack retainers for holding and supporting the tray stack housed in the container body from above and below.
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