| 摘要 |
<p>PURPOSE: A chip, a manufacturing method thereof, and an electronic part thereof are provided to prevent an electrical short-circuit by attaching a chip having a conductive polymer bump to a substrate. CONSTITUTION: A first metal layer is coated onto the surface of a plurality of holes and a photosensitive layer. A core polymer(240) is formed by solidifying a liquid polymer. A second metal layer is coated onto the surface of the core polymer and the first metal layer. A plurality of conductive polymer bumps, which are electrically insulated on the upper side of a wafer, are formed. A plurality of conductive polymers are projected to the upper side of the wafer. A chip having the conductive polymer bump is manufactured by cutting the wafer along a cutting line.</p> |
