| 摘要 |
An apparatus includes a backing material and a solid state component. The backing material carries a thermally conductive non-solid substance. The solid state component is set into the thermally conductive non-solid substance. The backing material is arranged with the solid state component so that the backing material may be removed from the apparatus leaving at least a portion of the thermally conductive non-solid substance on the solid state component for mounting to a heat sink.
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