发明名称 POLISHING PAD
摘要 A polishing pad which comprises a laminate of an abrasive layer with a cushioning layer. The abrasive layer has a Microrubber A hardness of 75 degrees or higher and a thickness of 0.8-3.0 mm. The cushioning layer comprises an unfoamed elastomer and has a thickness of 0.05-1.5 mm. The abrasive layer has at least two kinds of grooves formed in the surface. One of the two kinds of grooves is first grooves and the other is second grooves. The first grooves each has a groove width of 0.5-1.2 mm, and has a groove pitch of 7.5-50 mm. The second grooves each has a groove width of 1.5-3 mm, and has a groove pitch of 20-50 mm. Each of the first grooves and each of the second grooves are open to side edge faces of the abrasive layer.
申请公布号 US2011045753(A1) 申请公布日期 2011.02.24
申请号 US20090990434 申请日期 2009.05.13
申请人 TORAY INDUSTRIES, INC. 发明人 SHIRO KUNIYASU;HANAMOTO MIYUKI;HASHISAKA KAZUHIKO;KOBAYASHI TSUTOMU;YAMADA ATSUO
分类号 B24B37/22;B24B37/24;B24B37/26 主分类号 B24B37/22
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