CHEMICAL MECHANICAL POLISHING PAD AND FABRICATION METHODE OF THE SAME

摘要

PURPOSE: A CMP(Chemical Mechanical Polishing) pad and a manufacturing method thereof are provided to efficiently form a hole having the diameter of a particular size on a CMP pad by selecting the laser beam wavelength and light absorbent. CONSTITUTION: The diameter of a hole to be formed on a polishing pad is determined according to the kind of CMP process and the kind of polished material(102). The appropriate wavelength band of a laser beam(106) and specific kind of the laser are determined according to the decided diameter of the hole. The light absorbent which can absorb the light of the wavelength band is determined according to the determined wavelength of the laser beam.