| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate heating unit to effectively heat a substrate, and a substrate treating device including this. <P>SOLUTION: As for this substrate heating unit, heat generated from a resistance heating element is conducted to a support plate, and the substrate is heated. The support plate includes an upper plate in which thickness of an edge region is thicker as compared with that of the center region and a lower plate made of a material of which the thermal conductivity is lower compared with that of the upper plate. By differences in shape and material quality between the upper plate and the lower plate, the heat reaches the substrate at a higher rate in the edge region than that in the center region of the support plate, and the whole face of the substrate is homogeneously heated. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
