| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method which peels a laminate having a plurality of wiring substrate layers formed on both main surfaces of a support substrate from the support substrate without stress. SOLUTION: This method for manufacturing wiring substrates includes: the step (S1) of forming a laminating support substrate obtained by laminating the two support substrates which passes through ultraviolet rays by a first bonding agent layer in which adhesion vanishes or drops by irradiation of the ultraviolet rays; the step (S2) of coating the same bonding agent on both main surfaces of the laminating support substrate to form a second bonding agent layer; the step (S4) of forming the laminate for the wiring substrate composed of a conductor layer and an insulating layer on the second bonding agent layer; the step (S5) of irradiating the ultraviolet rays from a side face of the laminating support substrate; and the step (S8) of peeling the laminating support substrate. COPYRIGHT: (C)2011,JPO&INPIT |
