| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor production device that receives less influence of high temperatures during heat treatment and can easily insert and take out a wafer to be processed. <P>SOLUTION: A supporting part (2) having a high surface and a recessed connection part (3) are formed in a circular board holder (1), and a wafer (4) to be processed is placed on a supporting part (2) for a specified heat treatment. A tweezer of a wafer transfer machine is lowered or lifted to insert the wafer (4) in the supporting part (2) or take out it therefrom. <P>COPYRIGHT: (C)2004,JPO</p> |
