| 摘要 |
A substrate bonding apparatus for a liquid crystal display (LCD) panel is disclosed that subdivides its venting holes, thereby achieving an enhancement in uniformity of venting. The substrate bonding apparatus that bonds a first substrate and a second substrate using a venting process, includes a lower chucking plate which chucks the second substrate, and an upper chucking plate which includes a plurality of blocks each including a main venting hole, wherein the upper chucking plate chucks the first substrate in accordance with a chucking operation of the blocks, and subsequently releases the chucked first substrate such that the first substrate falls down toward the second substrate.
|
