发明名称 |
CURABLE COMPOSITION FOR FILLING BETWEEN FLAT PANEL DISPLAY MODULE AND TRANSPARENT COVER BOARD, AND ELECTRIC AND ELECTRONIC DEVICE MOUNTING FLAT PANEL DISPLAY OBTAINED BY APPLYING AND CURING THE SAME |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a curable composition for filling between a flat panel display module and a transparent cover board which can be cured by light at high speed, is not made uncured even in a portion which is not irradiated with light and has excellent visibility, impact resistance, heat resistance and light resistance of a cured product thereof. <P>SOLUTION: The curable composition contains a compound (A) having at least one hydrolyzable silyl group in one molecule on the average and a compound (B) having at least one polymerizable carbon-carbon double bond in one molecule on the average. <P>COPYRIGHT: (C)2011,JPO&INPIT |
申请公布号 |
JP2010248347(A) |
申请公布日期 |
2010.11.04 |
申请号 |
JP20090098404 |
申请日期 |
2009.04.14 |
申请人 |
KANEKA CORP;CHEMITEC KK |
发明人 |
TAMAI HITOSHI;HORI MITSUHIRO;OTSUKA NOBUYUKI |
分类号 |
C08F290/06;C08F299/00;G02F1/1335 |
主分类号 |
C08F290/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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