发明名称 CURABLE COMPOSITION FOR FILLING BETWEEN FLAT PANEL DISPLAY MODULE AND TRANSPARENT COVER BOARD, AND ELECTRIC AND ELECTRONIC DEVICE MOUNTING FLAT PANEL DISPLAY OBTAINED BY APPLYING AND CURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a curable composition for filling between a flat panel display module and a transparent cover board which can be cured by light at high speed, is not made uncured even in a portion which is not irradiated with light and has excellent visibility, impact resistance, heat resistance and light resistance of a cured product thereof. <P>SOLUTION: The curable composition contains a compound (A) having at least one hydrolyzable silyl group in one molecule on the average and a compound (B) having at least one polymerizable carbon-carbon double bond in one molecule on the average. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010248347(A) 申请公布日期 2010.11.04
申请号 JP20090098404 申请日期 2009.04.14
申请人 KANEKA CORP;CHEMITEC KK 发明人 TAMAI HITOSHI;HORI MITSUHIRO;OTSUKA NOBUYUKI
分类号 C08F290/06;C08F299/00;G02F1/1335 主分类号 C08F290/06
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