发明名称 MANUFACTURE OF CPI LAYER
摘要 PURPOSE: To provide a conductive polymer mutually connecting material having consistent low DC resistance by removing at least one part of a main surface so that the end of this chain projects by slipping off the an etched surface. CONSTITUTION: A surface layer is removed by a plasma etching process. That is, when plasma etching is performed, a chain end place, for example, a particle 16 projects by slipping off the etched surface layers 14 and 15. Here, an average end particle is exposed by a quantity equivalent to about half the diameter of its particle. Therefore, a conductive polymer mutually connecting material having consistent low DC resistance can be obtained.
申请公布号 JPH01166407(A) 申请公布日期 1989.06.30
申请号 JP19880277612 申请日期 1988.11.04
申请人 AMERICAN TELEPH & TELEGR CO <ATT> 发明人 UIRIAMU AARU RANBAATO;NENNSHIN RUU;REI DEAN RASUTO
分类号 B32B27/18;B29C70/64;B29C70/88;H01B1/22;H01L21/302;H01L21/3065;H01L21/52;H01L21/66;H01L23/492;H01L23/498;H01R13/24;H05K3/32 主分类号 B32B27/18
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