ALKALI-DEVELOPABLE NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD OF CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a negative photosensitive resin composition that is free from a problem of metal corrosion as the composition does not generate an acid during thermosetting, and to provide a production method of a cured relief pattern and a semiconductor device.

SOLUTION: The negative photosensitive resin composition contains 100 parts by mass of a polyhydroxyamide having a specified structure including a dihydroxy diamide unit and an optional diamide unit, 2 to 30 parts by mass of a vinylsulfone compound having a specified structure, and 3 to 30 parts by mass of a photo-base generator.

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