METALLIC PRINTED CIRCUIT BOARD TO IMPROVE THERMAL CONDUCTIVITY AND MANUFACTURING METHOD FOR THE SAME

摘要

PURPOSE: A structure of a metallic printed circuit board and a manufacturing method thereof are provided to prevent the damage of an insulation layer by protecting an insulation layer into an adhesive paste. CONSTITUTION: A main body member(101) is formed into a metal material. A metal oxide layer which includes cavities is formed by anodizing the upper side of the main body member. A complex insulating layer is formed by filling the insulating resin in the cavity. An adhesive layer is formed by spreading a thermosetting adhesive on the upper side of the complex insulating layer. A circuit layer is attached to the upper side of the adhesive layer. The circuit layer comprises a circuit formed with a etching process. A projection is formed on the lower side of the circuit layer which is attached to the upper side of the adhesive layer.