| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a sealant for an optical semiconductor device by which luminance of the optical semiconductor device is hardly reduced even when the optical semiconductor device is used under high temperature and high humidity, and to provide the optical semiconductor device. <P>SOLUTION: In the sealant for the optical semiconductor device including a silicone resin having an episulfide-containing group in its molecule and a thermosetting agent reacting with the episulfide-containing group, the silicone resin contains a resin component whose average composition formula is represented by formula (1):(R<SP>1</SP>R<SP>2</SP>R<SP>3</SP>SiO<SB>1/2</SB>)<SB>a</SB>(R<SP>4</SP>R<SP>5</SP>SiO<SB>2/2</SB>)<SB>b</SB>(R<SP>6</SP>SiO<SB>3/2</SB>)<SB>c</SB>(SiO<SB>4/2</SB>)<SB>d</SB>, and the content ratio of the episulfide-containing group is 3 to 50 mol%. In formula (1), a/(a+b+c+d)=0 to 0.2, b/(a+b+c+d)=0.3 to 1.0, c/(a+b+c+d)=0 to 0.5, and d/(a+b+c+d)=0 to 0.3 are satisfied, at least one of R<SP>1</SP>to R<SP>6</SP>denotes the episulfide-containing group and each of the others of R<SP>1</SP>to R<SP>6</SP>denotes a 1-8C straight or branched hydrocarbon or a fluoride thereof. <P>COPYRIGHT: (C)2010,JPO&INPIT |
