| 摘要 |
PURPOSE: An apparatus for cutting a substrate using a laser is provided to form a precise scribing line by varying the emission rate of a laser beam according to the progress of the scribing line. CONSTITUTION: An apparatus for cutting a substrate using a laser comprises a laser generator(100), a laser part(200), a cooling part(300), a transfer part(400), a rotation driving part, and a reflection part. The laser generator generates one or more laser beams. The laser part includes one or more laser units arranged along a first cutting line. The cooling part sprays cooling fluid on a substrate(700). The transfer part diversifies the relative position of the laser units and the cooling part with respect to the substrate according to the direction of a second cutting line. The rotation driving part rotates the laser units and the cooling part in order to be arranged in a line along the second cutting line. |
