发明名称 Liquid cooled power electronic circuit comprising a stacked array of directly cooled semiconductor chips
摘要 A stacked array of channeled semiconductor chips defining a power electronic circuit is mounted in a sealed container provided with inlet and outlet passages for liquid coolant. Leadframe terminals supported by the container engage selected terminals of the semiconductor chips and form leads for mounting the container on a circuit board having electrical and fluid interconnects.
申请公布号 US7795726(B2) 申请公布日期 2010.09.14
申请号 US20070799925 申请日期 2007.05.03
申请人 DELPHI TECHNOLOGIES, INC. 发明人 MYERS BRUCE A.;BRAUER ERIC A.
分类号 H01L23/34 主分类号 H01L23/34
代理机构 代理人
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