发明名称 METHOD OF CUTTING BRITTLE MATERIAL AND METHOD OF MANUFACTURING FLAT PANEL DISPLAY USING THE CUTTING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To achieve a stable cutting process while maintaining a sufficient laser moving speed, in the cutting method using a laser beam. <P>SOLUTION: The method of cutting a substrate composed of a brittle material by irradiating it with a laser beam includes: a process of heating the substrate by irradiating it with a laser beam; a process of cooling the irradiated region; a process of linearly scanning the irradiated region and the cooled region; and a process of pressurizing a force to a part of the irradiated and cooled regions. The method is characterized in that a difference T(s) between the irradiating time and the cooling time is expressed by T=vS(0.1t-h)/kP, where P (W) is a laser output; v (mm/s) is a laser beam moving speed; S (mm<SP>2</SP>) is a laser beam irradiation area; t (mm) is a substrate thickness; and k and h are coefficients. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010194550(A) 申请公布日期 2010.09.09
申请号 JP20090038885 申请日期 2009.02.23
申请人 PANASONIC CORP 发明人 GONDA HIROYUKI;TAKASE MICHIHIKO
分类号 B23K26/00;B23K26/38;B28D5/00;C03B33/09;G02F1/13;G02F1/1333;H01J9/24;H01J11/02;H01J11/12;H01J11/22;H01J11/24;H01J11/26;H01J11/34;H01J17/16 主分类号 B23K26/00
代理机构 代理人
主权项
地址