发明名称 |
METHOD OF CUTTING BRITTLE MATERIAL AND METHOD OF MANUFACTURING FLAT PANEL DISPLAY USING THE CUTTING METHOD |
摘要 |
<P>PROBLEM TO BE SOLVED: To achieve a stable cutting process while maintaining a sufficient laser moving speed, in the cutting method using a laser beam. <P>SOLUTION: The method of cutting a substrate composed of a brittle material by irradiating it with a laser beam includes: a process of heating the substrate by irradiating it with a laser beam; a process of cooling the irradiated region; a process of linearly scanning the irradiated region and the cooled region; and a process of pressurizing a force to a part of the irradiated and cooled regions. The method is characterized in that a difference T(s) between the irradiating time and the cooling time is expressed by T=vS(0.1t-h)/kP, where P (W) is a laser output; v (mm/s) is a laser beam moving speed; S (mm<SP>2</SP>) is a laser beam irradiation area; t (mm) is a substrate thickness; and k and h are coefficients. <P>COPYRIGHT: (C)2010,JPO&INPIT |
申请公布号 |
JP2010194550(A) |
申请公布日期 |
2010.09.09 |
申请号 |
JP20090038885 |
申请日期 |
2009.02.23 |
申请人 |
PANASONIC CORP |
发明人 |
GONDA HIROYUKI;TAKASE MICHIHIKO |
分类号 |
B23K26/00;B23K26/38;B28D5/00;C03B33/09;G02F1/13;G02F1/1333;H01J9/24;H01J11/02;H01J11/12;H01J11/22;H01J11/24;H01J11/26;H01J11/34;H01J17/16 |
主分类号 |
B23K26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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