| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wire bonding method such that a wire and a base such as an external terminal have superior bonding strength and the wire has superior strength. <P>SOLUTION: The wire bonding method includes: preparing a capillary 1 comprising at least a projection part 3a having a lead-out hole for a wire 4 and a press surface for the wire 4 such that the press surface is provided nearby the lead-out hole, a first tapered surface 3b forming the projection part 3a, a second tapered surface 3c retreating to a base end side more than the first tapered surface 3b at an outer peripheral side of the first tapered surface 3b, and a step part 3d coupling the first tapered surface 3b and second tapered surface 3c to each other; causing the projection part 3a and first tapered surface 3b to stick in the base 11 together with the wire 4 and simultaneously pressing the wire 4 against a surface 12 to be bonded while deforming the wire 4 with the press surface; and joining the wire 4, having been pressed to be deformed, to the surface 12 to be bonded; and then cutting the wire 4 at the projection part 3a. <P>COPYRIGHT: (C)2010,JPO&INPIT |
