发明名称 METHOD AND APPARATUS FOR MANUFACTURING WIRING BOARD
摘要 <P>PROBLEM TO BE SOLVED: To manufacture a high-definition and high-density wiring board while stabilizing quality. Ž<P>SOLUTION: The method for manufacturing the wiring board includes a step of jetting liquid containing a pattern forming material from a liquid jetting means 14 to a substrate B based on drawing data M and drawing a wiring pattern C on the substrate B. The method has: a drawing data processing step S2 for classifying the drawing data M into first drawing data MA and second drawing data MB; a first drawing step S3 for drawing a first wiring pattern CA on the substrate B with the liquid based on the first drawing data MA; a detecting step S4 for detecting a defect in the drawing of the drawn first wiring pattern CA; and a second drawing step S5 for jetting the liquid again on the detected drawing defect of the first wiring pattern CA to repair it, and drawing a second wiring pattern CB with the liquid on the substrate B based on the second drawing data MB. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010192733(A) 申请公布日期 2010.09.02
申请号 JP20090036257 申请日期 2009.02.19
申请人 SEIKO EPSON CORP 发明人 HOSOMI HIROAKI;KOMATSU KOICHIRO
分类号 H05K3/00;H05K3/10 主分类号 H05K3/00
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