| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a high-reliability and high-yield IC tag allowing miniaturization, and to provide a method for producing the same. <P>SOLUTION: The IC tag 10 includes: an inlet 100; a primary molded article 11 having a recessed part 111 disposed with the inlet 100 in the bottom face; and a secondary molded article 12 sealing the inlet 100, and can contactlessly communicate with an external apparatus. In the IC tag 10, the primary molded article 11 disposed or fixed with the inlet 100 in the bottom face 111a of the recessed part 111 is disposed inside secondary molds 710, 720, a secondary molding resin R2 is pressed in from a gate 721, and at least the recessed part is filled to mold the secondary molded article 12 sealing the inlet. The secondary molds 710, 720 use molds wherein the center line h1 of the gate 721 injecting the secondary molding resin R2 is formed in a position not crossing the inlet 100. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
