发明名称 |
METHOD OF TREATING A SURFACE TO PROTECT THE SAME |
摘要 |
<p>A method of treating a substrate by applying a layer of at least one metal to the substrate to form an applied metal layer on the substrate and followed by curing of the applied metal layer at sub-atmospheric pressure to form a metal protective layer. A method of treating a substrate by applying a layer of at least one metal to a substrate of an unassembled component of a reactor system to form an applied metal layer on the substrate of the unassembled component and curing the applied metal layer on the substrate of the unassembled component to form a metal protective layer. A method of treating a substrate by applying a layer of at least one metal to the substrate to form an applied metal layer, curing the applied metal layer at a first temperature and pressure for a first period of time, and curing the applied metal layer at a second temperature and pressure for a second period of time, wherein the curing forms a metal protective layer.</p> |
申请公布号 |
SG162745(A1) |
申请公布日期 |
2010.07.29 |
申请号 |
SG20100038644 |
申请日期 |
2006.05.31 |
申请人 |
CHEVRON PHILLIPS CHEMICAL CO LP |
发明人 |
HISE, ROBERT L.;SCANLON, GEOFFREY E.;BERGMEISTER III, JOSEPH;KNORR, DANIEL B |
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