| 摘要 |
Secure inlays for secure documents (200) such as a passport comprising an inlay substrate (208, 308, 408, 508, 608) may have laser ablated recesses (216, 316, 516, 616) within which a chip module (210, 510, 610) is installed. Channels for an antenna wire (220, 420, 520, 620) may be formed in a surface of the substrate. Patches (230, 542, 642) homogenous with the substrate layer may be used to protect and seal the chip and interconnection area. The inlay substrate may include two layers (208a, 208b), and the antenna wire may be between the two layers. A moisture-curing polyurethane hot melt adhesive may be used to laminate a cover layer and the additional inlay substrate layers. The adhesive layer may include metal nanoscale powder and ink for electro-magneticshielding. Additional security elements may include material that is optically changeable by an electro-magnetic field. |
