发明名称 LAMINATE FOR FLEXIBLE PRINTED WIRING BOARD, FLEXIBLE PRINTED WIRING BOARD, AND MANUFACTURING METHOD THEREOF
摘要 PURPOSE: A laminate for a flexible printed wiring board, the flexible printed wiring board, and a manufacturing method thereof are provided to implement a COF film carrier tape of an ultrafine pitch. CONSTITUTION: A through hole(13) is formed in an insulating member(11). A conductive layer(14) is comprised of a metal film which is adhered to one side of the insulating member with an adhesive layer. A buried conductor plating layer(15) is laid under a plurality of through holes. The conductor plating layer(18) is formed with a first conductor plating layer(16) and a second conductor plating layer(17). The first plating layer is proved on the surface of the insulating member and top side of the buried conductor plating layer. The second plating layer is completely conducted with the buried conductor plating layer.
申请公布号 KR20100068185(A) 申请公布日期 2010.06.22
申请号 KR20090100688 申请日期 2009.10.22
申请人 MITSUI MINING & SMELTING CO., LTD. 发明人 FUJIWARA KATSUHIKO;KAWAMURA HIROKAZU;KATAOKA TATSUO
分类号 H05K1/05;H05K3/46 主分类号 H05K1/05
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