发明名称 |
PROCESS FOR FABRICATING A SEMICONDUCTOR COMPONENT SUPPORT, SUPPORT AND SEMICONDUCTOR DEVICE |
摘要 |
An electrical connection support for receiving a semiconductor component includes an electrical connection plate having electrical connection pads. A stand-off structure is provided over the electrical connection pads. The stand-off structure may include a supplementary layer provided on a zone of the electrical connection plate which includes the electrical connection pads of the plate and is outside of a place configured to receive a semiconductor component. The stand-off structure further includes electrical connection vias passing through the supplementary layer. These vias are electrically connected to the electrical connection pads of the plate and have outer faces for making external electrical connection (for example, to another electrical connection support in a stacked structure).
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申请公布号 |
US2010148339(A1) |
申请公布日期 |
2010.06.17 |
申请号 |
US20090633724 |
申请日期 |
2009.12.08 |
申请人 |
STMICROELECTRONICS (GRENOBLE) SAS |
发明人 |
LOPEZ JEROME;REMBERT RICHARD |
分类号 |
H01L23/12;H05K1/16;H05K3/20 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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