RADIATION SENSOR DEVICE AND METHOD FOR FORMING SAID DEVICE

摘要

A radiation sensor device (10i) including an integrated circuit chip (12i) including a radiation sensor (14i) on a surface of the integrated chip, one or more electrical connections (22i, 24i) configured to connect between an active surface (20i) of the integrated circuit chip and a lead frame (26i, 30i), a cap (16i) attached to said integrated circuit chip spaced from and covering said radiation sensor, the cap having a transparent portion defining a primary- lens (38i) transparent to the radiation (44i) to be sensed, a secondary lens (100) disposed in a recess proximate and spaced from said primary lens transparent to the radiation to be sensed, and an air gap (104) between said primary lens and said secondary lens.